• JEDEC JESD202

JEDEC JESD202

METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS

JEDEC Solid State Technology Association, 03/01/2006

Publisher: JEDEC

File Format: PDF

$30.00$61.00


Published:01/03/2006

Pages:37

File Size:1 file , 370 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This is an accelerated stress test method for determining sample estimates and their confidence limits of the median-time-to-failure, sigma, and early percentile of a log-Normal distribution, which are used to characterize the electromigration failure-time distribution of equivalent metal lines subjected to a constant current-density and temperature stress. Failure is defined as some pre-selected fractional increase in the resistance of the line under test. Analysis procedures are provided to analyze complete and singly, right-censored failure-time data. Sample calculations for complete and right-censored data are provided in Annex A. The analyses are not intended for the case when the failure distribution cannot be characterized by a single log-Normal distribution.

More JEDEC standard pdf

JEDEC JESD 22-A121A (R2014)

JEDEC JESD 22-A121A (R2014)

MEASURING WHISKER GROWTH ON TIN AND TIN ALLOY SURFACE FINISHES

$37.00 $74.00

JEDEC JESD94A

JEDEC JESD94A

APPLICATION SPECIFIC QUALIFICATION USING KNOWLEDGE BASED TEST METHODOLOGY

$33.00 $67.00

JEDEC JEP 143B.01

JEDEC JEP 143B.01

SOLID STATE RELIABILITY ASSESSMENT QUALIFICATION METHODOLOGIES

$38.00 $76.00

JEDEC JESD22-B106D

JEDEC JESD22-B106D

RESISTANCE TO SOLDER SHOCK FOR THROUGH-HOLE MOUNTED DEVICES

$26.00 $53.00