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JEDEC Solid State Technology Association, 01/01/2012
Publisher: JEDEC
File Format: PDF
$95.00$191.00
Published:01/01/2012
Pages:145
File Size:1 file , 2.6 MB
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QUALITY SYSTEM ASSESSMENT (SUPERSEDES JESD39-A)
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THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)
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TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION
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ADDENDUM No. 11 to JESD24 - POWER MOSFET EQUIVALENT SERIES GATE RESISTANCE TEST METHOD
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