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JEDEC Solid State Technology Association, 11/01/2018
Publisher: JEDEC
File Format: PDF
$104.00$208.00
Published:01/11/2018
Pages:152
File Size:1 file , 2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
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EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
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1.8 V HIGH-SPEED LVCMOS (HS_LVCMOS) INTERFACE
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