JEDEC JESD217

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

JEDEC Solid State Technology Association, 09/01/2010

Publisher: JEDEC

File Format: PDF

$40.00$80.00

Description

Published:01/09/2010

Pages:44

File Size:1 file , 1.8 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.

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