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JEDEC JESD217.01

TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES

JEDEC Solid State Technology Association, 10/01/2016

Publisher: JEDEC

File Format: PDF

$43.00$87.00


Published:01/10/2016

Pages:46

File Size:1 file , 1.7 MB

Note:This product is unavailable in Russia, Ukraine, Belarus

As ball grid array component pitch continues to decrease, the need to characterize solder voiding has become more significant. Solder void manifestation (type and/or sizes) has been used to determine process capability as a means of quality assurance during process transfer, and as indicators of process stability from in-line manufacturing monitors. This document describes how to characterize voids in solder spheres in ball grid array packages prior to surface-mount (SMT) reflow soldering.

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