Your shopping cart is empty!
PDF Preview
JEDEC Solid State Technology Association, 11/01/2022
Publisher: JEDEC
File Format: PDF
$149.00$299.61
Published:01/11/2022
Pages:48
File Size:1 file , 2.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
FBDIMM SPECIFICATION: HIGH SPEED DIFFERENTIAL PTP LINK AT 1.5 V
$53.00 $106.00
DOUBLE DATA RATE (DDR) SDRAM SPECIFICATION
$70.00 $141.00
TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN INTEGRATED CIRCUITS
$27.00 $54.00
CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES
$30.00 $60.00
