Your shopping cart is empty!
PDF Preview
JEDEC Solid State Technology Association, 11/01/2022
Publisher: JEDEC
File Format: PDF
$149.00$299.61
Published:01/11/2022
Pages:48
File Size:1 file , 2.2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
DDR3 SDRAM STANDARD
$123.00 $247.00
EMBEDDED MULTIMEDIACARD(e*MMC) e*MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, including Reliable Write, Boot, Sleep Modes, Dual Data Rate, Multiple Partitions Supports, Security Enhancement, Background Operation and High Priority Interrupt (MMCA, 4.41)
STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
$33.00 $67.00
STANDARD TEST METHOD UTILIZING X-RAY FLUORESCENCE (XRF) FOR ANALYZING COMPONENT FINISHES AND SOLDER ALLOYS TO DETERMINE TIN (Sn) - LEAD (Pb) CONTENT
$26.00 $53.00
