Your shopping cart is empty!
PDF Preview
JEDEC Solid State Technology Association, 10/01/2022
Publisher: JEDEC
File Format: PDF
$100.00$200.03
Published:01/10/2022
Pages:48
File Size:1 file , 2.4 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
STANDARD LOGNORMAL ANALYSIS OF UNCENSORED DATA, AND OF SINGLY RIGHT -CENSORED DATA UTILIZING THE PERSSON AND ROOTZEN METHOD
$38.00 $76.00
ADDENDUM No. 8 to JESD24 - METHOD FOR REPETITIVE INDUCTIVE LOAD AVALANCHE SWITCHING
$25.00 $51.00
ADDENDUM No. 9 to JESD24 - SHORT CIRCUIT WITHSTAND TIME TEST METHOD
CMOS SEMICUSTOM DESIGN GUIDELINES
$70.00 $141.00