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JEDEC Solid State Technology Association, 10/01/2022
Publisher: JEDEC
File Format: PDF
$100.00$200.03
Published:01/10/2022
Pages:48
File Size:1 file , 2.4 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This publication provides an overview of solder void types, outlines current metrologies and test methods used for pre-SMPT solder void characterization and potential limitations, and prescribes sampling strategy for data collection, and tolerance guidelines for corrective measures.
SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS
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Low Power Double Data Rate 3 SDRAM (LPDDR3)
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STEADY-STATE TEMPERATURE HUMIDITY BIAS LIFE TEST
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PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY
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