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JEDEC Solid State Technology Association, 03/01/2016
Publisher: JEDEC
File Format: PDF
$38.00$76.00
Published:01/03/2016
Pages:36
File Size:1 file , 660 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - FORCED CONVECTION (MOVING AIR)
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EXTENSION OF THERMAL TEST BOARD STANDARDS FOR PACKAGES WITH DIRECT THERMAL ATTACHMENT MECHANISMS
HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES
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GUIDELINES FOR PREPARING CUSTOMER-SUPPLIED BACKGROUND INFORMATION RELATING TO A SEMICONDUCTOR-DEVICE FAILURE ANALYSIS
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