• JEDEC JESD22-A104F

JEDEC JESD22-A104F

Temperature Cycling

JEDEC Solid State Technology Association, 11/01/2020

Publisher: JEDEC

File Format: PDF

$29.00$59.00


Published:01/11/2020

Pages:18

File Size:1 file , 290 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This standard provides a method for determining solid state devices capability to withstand extreme temperature cycling. This standard applies to single-, dual- and triple-chamber temperature cycling and covers component and solder interconnection testing. It should be noted that this standard does not cover or apply to thermal shock chambers. This test is conducted to determine the ability of components and solder interconnects to withstand mechanical stresses induced by alternating high- and low-temperature extremes. Permanent changes in electrical and/or physical characteristics can result from these mechanical stresses.

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