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JEDEC Solid State Technology Association, 12/01/2022
Publisher: JEDEC
File Format: PDF
$112.00$225.35
Published:01/12/2022
Pages:13
File Size:1 file , 170 KB
Note:This product is unavailable in Russia, Belarus
This test is conducted to determine the robustness of a device to sudden exposure to extreme changes in temperature and to the effect of alternate exposures to these extremes.
Long-Term Storage for Electronic Solid-State Wafers, Dice, and Devices
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HERMETICITY
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IC LATCH-UP TEST
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FAILURE MECHANISMS AND MODELS FOR SEMICONDUCTOR DEVICES
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