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JEDEC Solid State Technology Association, 08/01/2018
Publisher: JEDEC
File Format: PDF
$33.00$67.00
Published:01/08/2018
Pages:26
File Size:1 file , 520 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
$31.00 $62.00
METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
$30.00 $61.00
CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
$36.00 $72.00
STANDARD TEST LOADS FOR DUAL-SUPPLY LEVEL TRANSLATION DEVICES
$25.00 $51.00