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JEDEC Solid State Technology Association, 01/01/2022
Publisher: JEDEC
File Format: PDF
$30.00$60.00
Published:01/01/2022
Pages:19
File Size:1 file , 600 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
The purpose of this test method is to provide a means for determining the moisture sorption properties of organic materials used in the packaging of electronic devices.
This standard details the procedures for the measurement of characteristic bulk material properties of moisture diffusivity and water solubility in organic materials used in the packaging of electronic devices. These two material properties are important parameters for the effective reliability performance of plastic packaged surface mount devices after exposure to moisture and subjected to high temperature solder reflow.
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION
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BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
$31.00 $62.00
METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
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CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
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