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JEDEC Solid State Technology Association, 10/01/2015
Publisher: JEDEC
File Format: PDF
$28.00$56.00
Published:01/10/2015
Pages:16
File Size:1 file , 62 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
3D Chip Stack with Through-Silicon Vias (TSVS): Identifying, Evaluating and Understanding Reliability Interactions
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TERMS, DEFINITIONS, AND LETTER SYMBOLS FOR DISCRETE SEMICONDUCTOR AND OPTOELECTRONIC DEVICES
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POD15 - 1.5 V Pseudo Open Drain I/O
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EMBEDDED MULTIMEDIACARD (e*MMC) e*MMC/CARD PRODUCT STANDARD, HIGH CAPACITY, INCLUDING RELIABLE WRITE, BOOT, AND SLEEP MODES (MMCA, 4.3)
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