JEDEC JESD22-B101D

External Visual

JEDEC Solid State Technology Association, 04/01/2022

Publisher: JEDEC

File Format: PDF

$28.00$56.00


Published:01/04/2022

Pages:16

File Size:1 file , 310 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

External visual inspection is an examination of the external surfaces, construction, marking, and workmanship of a finished packaged device. External visual is a noninvasive and nondestructive test. It is functional for qualification, quality monitoring, and lot acceptance.

This test method is applicable to:
- finished packaged devices only (hereafter referred to as 'devices');
    NOTE Devices sampled for external visual inspection must be considered physically representative of the as-shipped product.
- all solid-state device package types/styles;
- devices having attachments as shipped (see clause 3 for definition).

This test method is not applicable to:
- customer-processed devices (see clause 3 for definition);
- piece parts incoming to a device assembly operation, or to sub-assemblies in a manufacturing line (WIP);
- the carrier, dry bag, packing, or container used to ship devices;
- the orientation or loading aspects of devices in carriers, (applicable to the device only);
- the internal, non-viewable features of a device.

This test method does not apply to or require any inspection, measurement, or analysis other than the procedure described in clause 5.

This test method does not preclude the use of specialized tools or equipment to inspect or measure devices for conformance to physical specifications.

More JEDEC standard pdf

JEDEC JESD82-512 Rev. 1.00

JEDEC JESD82-512 Rev. 1.00

DDR5 Registering Clock Driver Definition (DDR5RCD02)

$120.00 $240.31

JEDEC JEP194

JEDEC JEP194

Guideline for Gate Oxide Reliability and Robustness Evaluation Procedures for Silicon Carbide Power MOSFETs

$121.00 $242.39

JEDEC JESD82-13A.01

JEDEC JESD82-13A.01

Definition of the SSTVN16859 2.5-2.6 V 13-Bit to 26-Bit SSTL_2 Registered Buffer for PC1600, PC2100, PC2700, and PC3200 DDR DIMM Applications

$124.00 $248.86

JEDEC JEP130C

JEDEC JEP130C

Guidelines for Packing and Labeling of Integrated Circuits in Unit Container Packing (Tubes, Trays, and Tape and Reel)

$124.00 $248.40