• JEDEC JESD22-B115A

JEDEC JESD22-B115A

SOLDER BALL PULL

JEDEC Solid State Technology Association, 08/01/2010

Publisher: JEDEC

File Format: PDF

$31.00$62.00


Published:01/08/2010

Pages:24

File Size:1 file , 370 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document describes a test method only; acceptance criteria and qualification requirements are not defined. This test method applies to solder ball pull force/energy testing prior to end-use attachment. Solder balls are pulled individually using mechanical jaws; force, fracture energy and failure mode data are collected and analyzed. Other specialized solder ball pull methods using a heated thermode, gang pulling of multiple solder joints, etc., are outside the scope of this document. Both low and high speed testing are covered by this document.

More JEDEC standard pdf

JEDEC JESD22-B114A

JEDEC JESD22-B114A

Mark Legibility

$28.00 $56.00

JEDEC JESD47I

JEDEC JESD47I

STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS

$36.00 $72.00

JEDEC JESD9B

JEDEC JESD9B

Inspection Criteria for Microelectronic Packages and Covers

$70.00 $141.00

JEDEC JS-001A-2011

JEDEC JS-001A-2011

ELECTROSTATIC DISCHARGE SENSITIVITY TESTING, HUMAN BODY MODEL (HBM) - COMPONENT LEVEL

$135.00 $271.06