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  • JEDEC JESD22-B116A

JEDEC JESD22-B116A

WIRE BOND SHEAR TEST

JEDEC Solid State Technology Association, 08/01/2009

Publisher: JEDEC

File Format: PDF

$31.00$62.00


Published:01/08/2009

Pages:17

File Size:1 file , 220 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This test provides a means for determining the strength of a gold ball bond to a die bonding surface or an aluminum wedge or stitch bond to a die or package bonding surface, and may be performed on pre-encapsulation or post-encapsulation parts. The wire bond shear test is destructive. It is appropriate for use in process development, process control and/or quality assurance.

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