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JEDEC Solid State Technology Association, 05/01/2014
Publisher: JEDEC
File Format: PDF
$31.00$62.00
Published:01/05/2014
Pages:22
File Size:1 file , 310 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$39.00 $79.00
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
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1.8 V HIGH-SPEED LVCMOS (HS_LVCMOS) INTERFACE
$24.00 $48.00
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
$33.00 $67.00