• Your shopping cart is empty!

  • JEDEC JESD22-B117B

JEDEC JESD22-B117B

SOLDER BALL SHEAR

JEDEC Solid State Technology Association, 05/01/2014

Publisher: JEDEC

File Format: PDF

$31.00$62.00


Published:01/05/2014

Pages:22

File Size:1 file , 310 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

More JEDEC standard pdf

JEDEC JESD232A.01

JEDEC JESD232A.01

Graphics Double Data Rate (GDDR5X) SGRAM Standard

$116.00 $232.50

JEDEC JESD309-S0-RCB

JEDEC JESD309-S0-RCB

DDR5 SODIMM Raw Card Annex B. Version 1.0

$124.00 $248.11

JEDEC JESD82-29A.01

JEDEC JESD82-29A.01

DEFINITION OF THE SSTE32882 REGISTERING CLOCK DRIVER WITH PARITY AND QUAD CHIP SELECTS FOR DDR3/DDR3L/DDR3U RDIMM 1.5 V/1.35 V/1.25 V APPLICATIONS

$109.00 $218.35

JEDEC JESD220F

JEDEC JESD220F

Universal Flash Storage (UFS)

$184.00 $369.00