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  • JEDEC JESD22-B117B

JEDEC JESD22-B117B

SOLDER BALL SHEAR

JEDEC Solid State Technology Association, 05/01/2014

Publisher: JEDEC

File Format: PDF

$31.00$62.00


Published:01/05/2014

Pages:22

File Size:1 file , 310 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

The purpose of this test is conducted to assess the ability of solder balls to withstand mechanical shear forces that may be applied during device manufacturing, handling, test, shipment and end-use conditions. Solder ball shear is a destructive test.

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