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JEDEC Solid State Technology Association, 09/01/2013
Publisher: JEDEC
File Format: PDF
$45.00$91.00
Published:01/09/2013
Pages:60
File Size:1 file , 1 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
TEST METHOD FOR THE MEASUREMENT OF MOISTURE DIFFUSIVITY AND WATER SOLUBILITY IN ORGANIC MATERIALS USED IN INTEGRATED CIRCUITS
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GUIDELINE FOR CHARACTERIZING SOLDER BUMP ELECTROMIGRATION UNDER CONSTANT CURRENT AND TEMPERATURE STRESS
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EMBEDDED MULTIMEDIACARD (e*MMC)MECHANICAL STANDARD