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JEDEC Solid State Technology Association, 03/01/2013
Publisher: JEDEC
File Format: PDF
$152.00$305.00
Published:01/03/2013
Pages:286
File Size:1 file , 970 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF SMT ICS FOR HANDHELD ELECTRONIC PRODUCTS
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Potential Failure Mode and Effects Analysis (FMEA)
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STRESS-TEST-DRIVEN QUALIFICATION OF INTEGRATED CIRCUITS
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Graphics Double Data Rate (GDDR6) SGRAM Standard
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