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JEDEC Solid State Technology Association, 08/01/2014
Publisher: JEDEC
File Format: PDF
$58.00$116.00
Published:01/08/2014
Pages:116
File Size:1 file , 3.5 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
INTEGRATED CIRCUIT THERMAL TEST METHOD ENVIRONMENTAL CONDITIONS - JUNCTION-TO-BOARD
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USER GUIDELINES FOR IR THERMAL IMAGING DETERMINATION OF DIE TEMPERATURE
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SIGNATURE ANALYSIS
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2.5 V BiCMOS LOGIC DEVICE FAMILY SPECIFICATION WITH 5 V TOLERANT INPUTS AND OUTPUTS