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JEDEC Solid State Technology Association, 11/01/1972
Publisher: JEDEC
File Format: PDF
$37.00$74.00
Published:01/11/1972
Pages:30
File Size:1 file , 480 KB
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TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT
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ACCELERATED MOISTURE RESISTANCE - UNBIASED HAST
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GUIDELINE FOR CONSTANT TEMPERATURE AGING TO CHARACTERIZE ALUMINUM INTERCONNECT METALLIZATIONS FOR STRESS-INDUCED VOIDING
TEST METHODS AND ACCEPTANCE PROCEDURES FOR THE EVALUATION OF POLYMERIC MATERIALS
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