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JEDEC Solid State Technology Association, 02/01/2020
Publisher: JEDEC
File Format: PDF
$95.00$191.00
Published:01/02/2020
Pages:122
File Size:1 file , 1.1 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
STANDARD FOR DESCRIPTION OF 54/74ABTXXX AND 74BCXXX TTL-COMPATIBLE BiCMOS LOGIC DEVICES
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METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)
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ADDENDUM No. 2 to JESD35 - TEST CRITERIA FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
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INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)