Your shopping cart is empty!
PDF Preview
JEDEC Solid State Technology Association, 08/01/2023
Publisher: JEDEC
File Format: PDF
$106.00$213.20
Published:01/08/2023
Pages:82
File Size:1 file , 1.3 MB
Note:This product is unavailable in Russia, Belarus
This standard defines the specifications of interface parameters, signaling protocols, and features for fifth generation Temperature Sensor (TS5) as used for memory module applications. These device operate on I2C and I3C two-wire serial bus interface. The designation TS521X and TS511X refers to the device specified by this document.
The purpose is to provide a standard for the TS5 device for uniformity, multiplicity of sources, elimination of confusion, ease of device specification, and ease of use.
Unless otherwise noted in the document, any illegal operation is not allowed and device operation is not guaranteed.
NOTE: The designation TS521X and TS511X refers to a portion of the part number designation of a series of commercial logic devices common in the industry. This number is normally preceded by a series of manufacturer specific characters to make up a complete part designation.
Handling, Packing, Shipping, and Use of Moisture/Reflow Sensitive Surface-Mount Devices
$44.00 $89.00
RECOMMENDED ESD TARGET LEVELS FOR HBM QUALIFICATION
$45.00 $91.00
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$39.00 $79.00
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
$31.00 $62.00