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JEDEC Solid State Technology Association, 06/01/2022
Publisher: JEDEC
File Format: PDF
$127.00$255.22
Published:01/06/2022
Pages:24
File Size:1 file , 540 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This annex JESD309-S0-RCA, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card A Annex defines the design detail of x8, 1 Package Rank DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.
HERMETICITY
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STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (WIDE RANGE OPERATION)
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STANDARD DESCRIPTION OF 1.2 V CMOS LOGIC DEVICES (NORMAL RANGE OPERATION)
TEST BOARDS FOR THROUGH-HOLE AREA ARRAY LEADED PACKAGE THERMAL MEASUREMENT
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