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JEDEC Solid State Technology Association, 08/01/2022
Publisher: JEDEC
File Format: PDF
$124.00$248.11
Published:01/08/2022
Pages:26
File Size:1 file , 670 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This annex JESD309-S0-RCB, DDR5 Small Outline Dual Inline Memory Module with 0-bit ECC (EC0 SODIMM) Raw Card B Annex" defines the design detail of x8, 2 Package Ranks DDR5 NECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.
STRESS-TEST-DRIVEN QUALIFICATION OF AND FAILURE MECHANISMS ASSOCIATED WITH ASSEMBLED SOLID STATE SURFACE-MOUNT COMPONENTS
$33.00 $67.00
GDDR5 SGRAM
$95.00 $191.00
Descriptive Designation System for Semiconductor-device Packages
$37.00 $74.00
Characterization of Interfacial Adhesion in Semiconductor Packages
$36.00 $72.00
