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JEDEC Solid State Technology Association, 06/01/2022
Publisher: JEDEC
File Format: PDF
$106.00$212.66
Published:01/06/2022
Pages:22
File Size:1 file , 500 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This annex JESD309-S0-RCC, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Raw Card C Annex defines the design detail of x16, 1 Package Ranks DDR5 SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.
STANDARD TEST AND PROGRAMMING LANGUAGE (STAPL)
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DESCRIPTION OF 5 V BUS SWITCH WITH TTL-COMPATIBLE CONTROL INPUTS
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SYMBOL AND LABELS FOR MOISTURE-SENSITIVE DEVICES
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JOINT IPC/JEDEC STANDARD FOR ACOUSTIC MICROSCOPY FOR NONHERMETRIC ENCAPSULATED ELECTRONIC COMPONENTS
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