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JEDEC Solid State Technology Association, 06/01/2022
Publisher: JEDEC
File Format: PDF
$130.00$261.53
Published:01/06/2022
Pages:24
File Size:1 file , 820 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This annex JESD309-S4-RCE, DDR5 Small Outline Dual Inline Memory Module with 4-bit ECC (EC4 SODIMM) Raw Card E Annex" defines the design detail of x8, 2 Package Ranks DDR5 ECC SODIMM. The common feature of DDR5 SODIMM such as the connector pinout can be found in the JESD309, DDR5 Small Outline Dual Inline Memory Module (SODIMM) Common Standard.
JOINT IPC/JEDEC STANDARD FOR Moisture/Reflow Sensitivity Classification for Non-hermetic Surface Mount Devices (SMDs)
$144.00 $289.56
Secure Serial Flash Bus Transactions Version 1.0
$104.00 $208.74
Stress-Test-Driven Qualification of Integrated Circuits
$109.00 $219.54
SELECTION OF BURN-IN/LIFE TEST CONDITIONS AND CRITICAL PARAMETERS FOR QML MICROCIRCUITS
$104.00 $208.97
