Your shopping cart is empty!
JEDEC Solid State Technology Association, 09/01/2010
Publisher: JEDEC
File Format: PDF
$33.00$67.00
Published:01/09/2010
Pages:26
File Size:1 file , 87 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
Handling, Packing, Shipping and Use of Moisture, Reflow, and Process Sensitive Devices
$39.00 $79.00
EVALUATION PROCEDURE FOR DETERMINING CAPABILITY TO BOTTOM SIDE BOARD ATTACH BY FULL BODY SOLDER IMMERSION OF SMALL SURFACE MOUNT SOLID STATE DEVICES
$31.00 $62.00
1.8 V HIGH-SPEED LVCMOS (HS_LVCMOS) INTERFACE
$24.00 $48.00
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
$33.00 $67.00