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JEDEC Solid State Technology Association, 08/01/2023
Publisher: JEDEC
File Format: PDF
$102.00$204.64
Published:01/08/2023
Pages:38
File Size:1 file , 1.1 MB
Note:This product is unavailable in Russia, Belarus
The following labels shall be applied to all DDR5 memory modules to fully describe the key attributes of the module. The label can be in the form of a stick-on label, silk screened onto the assembly, or marked using an alternate customer-readable format. A readable point size should be used, and the number can be printed in one or more rows on the label. Hyphens may be dropped when lines are split, or when font changes sufficiently.
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THERMAL TEST BOARD STANDARDS TO ACCOMMODATE MULTI-CHIP PACKAGES
INTERFACE TEST METHOD FOR THE MEASUREMENT OF THE THERMAL RESISTANCE JUNCTION-TO-CASE OF SEMICONDUCTOR DEVICES WITH HEAT FLOW TROUGH A SINGLE PATH
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