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JEDEC Solid State Technology Association, 03/01/2022
Publisher: JEDEC
File Format: PDF
$31.00$62.00
Published:01/03/2022
Pages:22
File Size:1 file , 370 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document specifies standard temperature ranges that may be used, by way of referencing JESD402-1, in other standards, specifications, and datasheets when defining temperature related specifications.
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION
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BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
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METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
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CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
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