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JEDEC Solid State Technology Association, 04/01/2011
Publisher: JEDEC
File Format: PDF
$36.00$72.00
Published:01/04/2011
Pages:28
File Size:1 file , 260 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
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METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
$30.00 $61.00
CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
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STANDARD TEST LOADS FOR DUAL-SUPPLY LEVEL TRANSLATION DEVICES
$25.00 $51.00