JEDEC JESD51

METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)

JEDEC Solid State Technology Association, 12/01/1995

Publisher: JEDEC

File Format: PDF

$25.00$51.00

Description

Published:01/12/1995

Pages:9

File Size:1 file , 150 KB

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This standard and its subsequent addendum's, provides a standard for thermal measurement that, if followed fully, will provide correct and meaningful data that will allow for determination of junction temperature for specific conditions. The data can be used for package design evaluation, device characterization and reliability predictions.

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