• Your shopping cart is empty!

  • JEDEC JESD51-1

JEDEC JESD51-1

INTEGRATED CIRCUIT THERMAL MEASUREMENT METHOD - ELECTRICAL TEST METHOD (SINGLE SEMICONDUCTOR DEVICE)

JEDEC Solid State Technology Association, 12/01/1995

Publisher: JEDEC

File Format: PDF

$39.00$78.00


Published:01/12/1995

Pages:36

File Size:1 file , 560 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

The purpose of this test method is to define a standard Electrical Test Method (ETM) that can be used to determine the thermal characteristics of single integrated circuit devices housed in some form of electrical package. This method will provide a basis for comparison of different devices housed in the same electronic package or similar devices housed in different electronic packages.

More JEDEC standard pdf

JEDEC JESD82-4B

JEDEC JESD82-4B

STANDARD FOR DEFINITION OF THE SSTV16859 2.5 V, 13-BIT TO 26-BIT SSTL_2 REGISTERED BUFFER FOR STACKED DDR DIMM APPLICATIONS

$29.00 $59.00

JEDEC JESD 22-B105C (R2006)

JEDEC JESD 22-B105C (R2006)

LEAD INTEGRITY

$30.00 $60.00

JEDEC JEP104C.01

JEDEC JEP104C.01

REFERENCE GUIDE TO LETTER SYMBOLS FOR SEMICONDUCTOR DEVICES

$58.00 $116.00

JEDEC JEP145

JEDEC JEP145

GUIDELINE FOR ASSESSING THE CURRENT-CARRYING CAPABILITY OF THE LEADS IN A POWER PACKAGE SYSTEM

$26.00 $53.00