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JEDEC Solid State Technology Association, 07/01/2000
Publisher: JEDEC
File Format: PDF
$28.00$56.00
Published:01/07/2000
Pages:16
File Size:1 file , 100 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
STANDARD METHOD FOR CALCULATING THE ELECTROMIGRATION MODEL PARAMETERS FOR CURRENT DENSITY AND TEMPERATURE
$39.00 $78.00
BOND WIRE MODELING STANDARD
$28.00 $56.00
QUALITY SYSTEM ASSESSMENT (SUPERSEDES JESD39-A)
$40.00 $80.00
THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)