• JEDEC JESD51-10

JEDEC JESD51-10

TEST BOARDS FOR THROUGH-HOLE PERIMETER LEADED PACKAGE THERMAL MEASUREMENTS

JEDEC Solid State Technology Association, 07/01/2000

Publisher: JEDEC

File Format: PDF

$28.00$56.00


Published:01/07/2000

Pages:16

File Size:1 file , 100 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This standard covers the design of printed circuit boards (PCBs) used in the thermal characterization of Dual-Inline Packages (DIP) and Single-Inline Packages (SIP). It is intended to be used in conjunction with the JESD51 series of standards that cover the test methods and test environments. JESD51-10 was developed to give a figure-of-merit of thermal performance that allows for accurate comparisons of packages from different suppliers. It can be used to give a first order approximation of system performance and, in conjunction with the other JESD51 PCB standards, allows for comparisons of the various package families.

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