• Your shopping cart is empty!

  • JEDEC JESD51-12.01

JEDEC JESD51-12.01

GUIDELINES FOR REPORTING AND USING ELECTRONIC PACKAGE THERMAL INFORMATION

JEDEC Solid State Technology Association, 11/01/2012

Publisher: JEDEC

File Format: PDF

$36.00$72.00


Published:01/11/2012

Pages:28

File Size:1 file , 270 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document provides guidelines for both reporting and using electronic package thermal information generated using JEDEC JESD51 standards. By addressing these two areas, this document can be used as the common basis for discussion between electronic package thermal information suppliers and users.

More JEDEC standard pdf

JEDEC JESD 24-11 (R2002)

JEDEC JESD 24-11 (R2002)

ADDENDUM No. 11 to JESD24 - POWER MOSFET EQUIVALENT SERIES GATE RESISTANCE TEST METHOD

$24.00 $48.00

JEDEC JEP128

JEDEC JEP128

GUIDE FOR STANDARD PROBE PAD SIZES AND LAYOUTS FOR WAFER LEVEL ELECTRICAL TESTING

$25.00 $51.00

JEDEC JESD8-8

JEDEC JESD8-8

ADDENDUM No. 8 to JESD8 - STUB SERIES TERMINATED LOGIC FOR 3.3 VOLTS (SSTL_3) A 3.3 V VOLTAGE BASED INTERFACE STANDARD FOR DIGITAL INTEGRATED CIRCUITS

$29.00 $59.00

JEDEC JESD51-3

JEDEC JESD51-3

LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES

$26.00 $53.00