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JEDEC Solid State Technology Association, 06/01/2009
Publisher: JEDEC
File Format: PDF
$27.00$54.00
Published:01/06/2009
Pages:14
File Size:1 file , 160 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
WIRE BOND SHEAR TEST
$31.00 $62.00
Material Composition Declaration for Electronic Products
$40.00 $80.00
Glossary of Thermal Measurement Terms and Definitions
$27.00 $54.00
CHIP-PACKAGE INTERACTION UNDERSTANDING, IDENTIFICATION AND EVALUATION
$33.00 $67.00