JEDEC JESD51-4

THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)

JEDEC Solid State Technology Association, 02/01/1997

Publisher: JEDEC

File Format: PDF

$28.00$56.00

Description

Published:01/02/1997

Pages:15

File Size:1 file , 310 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This guideline describes design requirements for wire bond type semiconductor chips to be used for thermal resistance listing of IC packages. This document provides specific guidelines for chip design but allows flexibility in the materials and layout requirements.