JEDEC JESD51-7

HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES

JEDEC Solid State Technology Association, 02/01/1999

Publisher: JEDEC

File Format: PDF

$26.00$53.00

Description

Published:01/02/1999

Pages:12

File Size:1 file

Note:This product is unavailable in Russia, Ukraine, Belarus

This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%.

More JEDEC standard pdf

JEDEC JESD 82-26

DEFINITION OF THE SSTUB32868 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS

$37.00 $74.00

JEDEC JESD 82-24

DEFINITION OF the SSTUB32865 28-bit 1:2 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS

$36.00 $72.00

JEDEC JESD82-9B

DEFINITION OF SSTU32865 REGISTERED BUFFER WITH PARITY FOR 2R x 4 DDR2 RDIMM APPLICATIONS

$33.00 $67.00

JEDEC JESD 82-23

DEFINITION OF the SSTUA32S869 AND SSTUA32D869 REGISTERED BUFFER WITH PARITY FOR DDR2 RDIMM APPLICATIONS

$37.00 $74.00