JEDEC JESD51-7

HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD FOR LEADED SURFACE MOUNT PACKAGES

JEDEC Solid State Technology Association, 02/01/1999

Publisher: JEDEC

File Format: PDF

$26.00$53.00

Description

Published:01/02/1999

Pages:12

File Size:1 file

Note:This product is unavailable in Russia, Ukraine, Belarus

This fixturing further defines the environment for thermal test of packaged microelectronic devices. Its function is to provide an alternate mounting surface for the analysis of heat flow in electronic components. The objective of the standard is to provide a high effective thermal conductivity mounting surface that can be compared equally against standard tests done in different laboratories with typical variations of less than or equal to 10%.

More JEDEC standard pdf

JEDEC JEP153A

CHARACTERIZATION AND MONITORING OF THERMAL STRESS TEST OVEN TEMPURATURES

$30.00 $60.00

JEDEC JESD246

Customer Notification Process for Disasters

$25.00 $51.00

JEDEC JEP166

JC-42.6 MANUFACTURER IDENTIFICATION (ID) CODE FOR LOW POWER MEMORIES

$36.00 $72.00

JEDEC JP001A

FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)

$43.00 $87.00