• JEDEC JESD59

JEDEC JESD59

BOND WIRE MODELING STANDARD

JEDEC Solid State Technology Association, 06/01/1997

Publisher: JEDEC

File Format: PDF

$28.00$56.00


Published:01/06/1997

Pages:16

File Size:1 file , 260 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

More JEDEC standard pdf

JEDEC JESD230F.01

JEDEC JESD230F.01

NAND Flash Interface Interopability

$136.00 $273.55

JEDEC JEP114A

JEDEC JEP114A

Guidelines for Particle Impact Noise Detection (PIND) Testing, Operator Training, and Certification

$127.00 $254.29

JEDEC JESD22-A104F.01

JEDEC JESD22-A104F.01

Temperature Cycling

$139.00 $279.57

JEDEC JESD82-28A.01

JEDEC JESD82-28A.01

Fully Buffered DIMM Design for Test, Design for Validation (DFx)

$126.00 $253.65