JEDEC JESD59

BOND WIRE MODELING STANDARD

JEDEC Solid State Technology Association, 06/01/1997

Publisher: JEDEC

File Format: PDF

$28.00$56.00

Description

Published:01/06/1997

Pages:16

File Size:1 file , 260 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

More JEDEC standard pdf

JEDEC JESD 471 (R2009)

SYMBOL AND LABEL FOR ELECTROSTATIC SENSITIVE DEVICES

$24.00 $48.00

JEDEC JESD82-6A.01

DEFINITION OF THE SSTV32852 2.5 V 24-BIT TO 48-BIT SSTL_2 REGISTERED BUFFER FOR 1U STACKED DDR DIMM APPLICATIONS

$121.00 $242.67

JEDEC JESD46D

CUSTOMER NOTIFICATION OF PRODUCT/PROCESS CHANGES BY ELECTRONIC PRODUCT SUPPLIERS

$27.00 $54.00

Errata to 2022 California Building Code, Title 24, Part 2 (Volumes 1 & 2)

$115.00 $231.95