JEDEC JESD59

BOND WIRE MODELING STANDARD

JEDEC Solid State Technology Association, 06/01/1997

Publisher: JEDEC

File Format: PDF

$28.00$56.00

Description

Published:01/06/1997

Pages:16

File Size:1 file , 260 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This standard describes the modeling of a bond wire from an integrated circuit (IC) die to a package lead in a ball or wedge type wire bond configuration.

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