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JEDEC Solid State Technology Association, 08/01/2001
Publisher: JEDEC
File Format: PDF
$25.00$51.00
Published:01/08/2001
Pages:10
File Size:1 file , 86 KB
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GUIDELINE FOR DEVELOPING AND DOCUMENTING PACKAGE ELECTRICAL MODELS DERIVED FROM COMPUTATIONAL ANALYSIS
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STANDARD FOR DESCRIPTION OF 54/74ABTXXX AND 74BCXXX TTL-COMPATIBLE BiCMOS LOGIC DEVICES
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METHODOLOGY FOR THE THERMAL MEASUREMENT OF COMPONENT PACKAGES (SINGLE SEMICONDUCTOR DEVICE)
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ADDENDUM No. 2 to JESD35 - TEST CRITERIA FOR THE WAFER-LEVEL TESTING OF THIN DIELECTRICS
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