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JEDEC Solid State Technology Association, 11/01/1999
Publisher: JEDEC
File Format: PDF
$24.00$48.00
Published:01/11/1999
Pages:7
File Size:1 file , 98 KB
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BOND WIRE MODELING STANDARD
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QUALITY SYSTEM ASSESSMENT (SUPERSEDES JESD39-A)
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THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)
TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION
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