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JEDEC Solid State Technology Association, 03/01/2006
Publisher: JEDEC
File Format: PDF
$26.00$53.00
Published:01/03/2006
Pages:11
File Size:1 file , 84 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION
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BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
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METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
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CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
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