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JEDEC Solid State Technology Association, 08/01/2012
Publisher: JEDEC
File Format: PDF
$114.00$228.00
Published:01/08/2012
Pages:188
File Size:1 file , 1.5 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
BOND WIRE MODELING STANDARD
$28.00 $56.00
QUALITY SYSTEM ASSESSMENT (SUPERSEDES JESD39-A)
$40.00 $80.00
THERMAL TEST CHIP GUIDELINE (WIRE BOND TYPE CHIP)
TEST PROCEDURE FOR THE MANAGEMENT OF SINGLE-EVENT EFFECTS IN SEMICONDUCTOR DEVICES FROM HEAVY ION IRRADIATION
$43.00 $87.00