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JEDEC Solid State Technology Association, 12/01/2013
Publisher: JEDEC
File Format: PDF
$58.00$116.00
Published:01/12/2013
Pages:74
File Size:1 file , 940 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
REQUIREMENTS FOR MICROELECTRONIC SCREENING AND TEST OPTIMIZATION
$38.00 $76.00
BOARD LEVEL CYCLIC BEND TEST METHOD FOR INTERCONNECT RELIABILITY CHARACTERIZATION OF COMPONENTS FOR HANDHELD ELECTRONIC PRODUCTS
$31.00 $62.00
METHOD FOR CHARACTERIZING THE ELECTROMIGRATION FAILURE TIME DISTRIBUTION OF INTERCONNECTS UNDER CONSTANT-CURRENT AND TEMPERATURE STRESS
$30.00 $61.00
CURRENT TIN WHISKERS THEORY AND MITIGATION PRACTICES GUIDELINE
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