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JEDEC Solid State Technology Association, 05/01/2007
Publisher: JEDEC
File Format: PDF
$40.00$80.00
Published:01/05/2007
Pages:43
File Size:1 file , 440 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
TEST METHODS TO CHARACTERIZE VOIDING IN PRE-SMT BALL GRID ARRAY PACKAGES
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IC LATCH-UP TEST
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COPLANARITY TEST FOR SURFACE-MOUNT SEMICONDUCTOR DEVICES
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SOLID STATE DRIVE (SSD) ENDURANCE WORKLOADS
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