Your shopping cart is empty!
PDF Preview
JEDEC Solid State Technology Association, 01/01/2023
Publisher: JEDEC
File Format: PDF
$132.00$265.05
Published:01/01/2023
Pages:200
File Size:1 file , 2 MB
Note:This product is unavailable in Russia, Ukraine, Belarus
This document is a core specification for a Fully Buffered DIMM (FBD) memory system. This document, along with the other core specifications, must be treated as a whole. Information critical to a Advanced Memory Buffer design appears in the other specifications, with specific cross-references provided.
POD135 - 1.35 V Pseudo Open Drain I/O
$33.00 $67.00
POD125 - 1.25 V Pseudo Open Drain I/O
$30.00 $60.00
Thermal Test Chip Guideline (Wire Bond Type Chip)
Mechanical Shock - Device and Subassembly
$27.00 $54.00