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JEDEC Solid State Technology Association, 03/01/2022
Publisher: JEDEC
File Format: PDF
$30.00$60.00
Published:01/03/2022
Pages:20
File Size:1 file , 370 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
The method described in this document applies to all reliability mechanisms associated with electronic devices.
The purpose of this standard is to provide a reference for developing acceleration models for defect-related and wear-out mechanisms in electronic devices.
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PROCEDURE FOR THE EVQLUQTION OF LOW-k/METAL INTER/INTRA-LEVEL DIELECTRIC INTEGRITY
Addendum No. 1 to JESD79-3 - 1.35 V DDR3L-800, DDR3L-1066, DDR3L-1333, and DDR3L-1600
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POD135 - 1.35 V PSEUDO OPEN DRAIN I/O
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