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JEDEC Solid State Technology Association, 03/01/2022
Publisher: JEDEC
File Format: PDF
$30.00$60.00
Published:01/03/2022
Pages:20
File Size:1 file , 370 KB
Note:This product is unavailable in Russia, Ukraine, Belarus
The method described in this document applies to all reliability mechanisms associated with electronic devices.
The purpose of this standard is to provide a reference for developing acceleration models for defect-related and wear-out mechanisms in electronic devices.
EXTERNAL VISUAL
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HSUL_12 LPDDR2 I/O
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EMBEDDED MULTIMEDIACARD (e-MMC) MECHANICAL STANDARD, WITH OPTIONAL RESET SIGNAL
WIRE BOND SHEAR TEST
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