• JEDEC JP001A

JEDEC JP001A

FOUNDRY PROCESS QUALIFICATION GUIDELINES (Wafer Fabrication Manufacturing Sites)

JEDEC Solid State Technology Association, 02/01/2014

Publisher: JEDEC

File Format: PDF

$43.00$87.00


Published:01/02/2014

Pages:48

File Size:1 file , 310 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This document provides a guideline for the minimum set of measurements to qualify a new semiconductor wafer process. It is written with particular reference to a generic silicon based CMOS logic technology. While it may be applicable to other technologies (e.g., analog CMOS, bipolar, BICMOS, GaAs, etc.), some sections apply specifically to CMOS. No effort was made in the present document to cover all the qualification requirements for specific other technologies, e.g., Cu/Low K interconnects or ultra thin gate oxide. This publication, is co-sponsored by JEDEC JC-14.2 and the FSA (Fabless Semiconductor Association). It originated at the FSA as a technology specific document, and has evolved into a generic set of qualification requirements.

More JEDEC standard pdf

JEDEC JESD30E

JEDEC JESD30E

DESCRIPTIVE DESIGNATION SYSTEM FOR SEMICONDUCTOR-DEVICE PACKAGES

$36.00 $72.00

JEDEC JESD15-4

JEDEC JESD15-4

DELPHI COMPACT THERMAL MODEL GUIDELINE

$33.00 $67.00

JEDEC JESD201A

JEDEC JESD201A

ENVIRONMENTAL ACCEPTANCE REQUIREMENTS FOR TIN WHISKER SUSCEPTIBILITY OF TIN AND TIN ALLOY SURFACE FINISHED

$37.00 $74.00

JEDEC JEP 155

JEDEC JEP 155

RECOMMENDED ESD TARGET LEVELS FOR HBM/MM QUALIFICATION

$45.00 $91.00