• Your shopping cart is empty!

  • JEDEC JS 9702

JEDEC JS 9702

IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)

JEDEC Solid State Technology Association, 06/01/2004

Publisher: JEDEC

File Format: PDF

$30.00$60.00


Published:01/06/2004

Pages:19

File Size:1 file , 230 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/fail requirements are typically specific to each device application and are outside the scope of this document.

More JEDEC standard pdf

JEDEC JESD8-26

JEDEC JESD8-26

1.2 V High-Speed LVCMOS (HS_LVCMOS) Interface

$24.00 $48.00

JEDEC JESD8-24

JEDEC JESD8-24

POD12-1.2 V Pseudo Open Drain Interface

$142.00 $284.00

JEDEC JESD223

JEDEC JESD223

Universal Flash Storage (UFS) Host Controller Interface

$45.00 $91.00

JEDEC JS709

JEDEC JS709

JOINT JEDEC/ECA STANDARD, DEFINING "LOW-HALOGEN" PASSIVES AND SOLID STATE DEVICES (Removal of BFR/CFR/PVC)

$30.00 $60.00