JEDEC JS 9702

IPC/JEDEC-9702: MONOTONIC BEND CHARACTERIZATION OF BOARD-LEVEL INTERCONNECTS (IPC/JEDEC-9702)

JEDEC Solid State Technology Association, 06/01/2004

Publisher: JEDEC

File Format: PDF

$30.00$60.00

Description

Published:01/06/2004

Pages:19

File Size:1 file , 230 KB

Note:This product is unavailable in Russia, Ukraine, Belarus

This publication specifies a common method of establishing the fracture resistance of board-level device interconnects to flexural loading during non-cyclic board assembly and test operations. Monotonic bend test qualification pass/fail requirements are typically specific to each device application and are outside the scope of this document.

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