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Association Connecting Electronics Industries, 11/01/2000
Publisher: IPC
File Format: PDF
$310.00$621.00
Published:01/11/2000
Qualification & Performance Specification for High Density Interconnect (HDI) Layers or Boards
$48.00 $97.00
Acoustic Microscopy for Non-Hermetic Encapsulated Electronic Components
Specifications for High Density Interconnect (HDI) and Microvia Materials
$71.00 $142.00
Standard for Handling, Packing, Shipping and Use of Moisture/Reflow Sensitive Surface Mount Devices
$43.00 $86.00